US 5,179,396 AGranted

Light emitting diode print head

AssigneeSamsung Electronics Co., Ltd.

InventorSeung-Sik Jeong

Life of this patent

Estimating the term…

Loading patent…

Abstract

In a light emitting diode print head of the dynamic drive method type including an upper substrate having a transversely elongated opening, a plurality of common electrodes arranged on the first side region of the opening of the upper substrate in parallel therewith, a plurality of light emitting diode array chips each mounted on one of the common electrodes, a plurality of drive circuits arranged on the second side region of the opening of the upper substrate, a plurality of drive ICs mounted on the upper substrate between the opening and the drive circuits, the number of the drive ICs being the same as that of the array chips, a lower substrate divided into a plurality of wiring regions and having the same size as that of the upper substrate, the number of the wiring regions being the same as that of the drive ICs, and a plurality of individual electrode wirings of undulated form arranged on the wiring regions along the length of the lower substrate and corresponding to the electrode pads of the light emitting diode array chips, wherein the upper substrate is mounted on the lower substrate.

Claims8

Dependent claims

A light emitting diode print head comprising:

an upper substrate having a transversely elongated opening;
a plurality of common electrodes arranged in a row on a first side region of said transversely elongated opening;
a plurality of light emitting diode array chips each mounted on a different one of said plurality of common electrodes;
a plurality of drive circuits arranged on a second side region of said transversely elongated opening;
a plurality of drive chips mounted on said upper substrate between said transversely elongated opening and said drive circuits, each of said plurality of drive chips being in one to one correspondence with a different one of said plurality of drive circuits;
a lower substrate divided into a plurality of wiring regions, said plurality of wiring regions each being in one to one correspondence with a different one of said plurality of drive chip means;
and
a plurality of individual electrode wirings of each disposed on a different one of said plurality of wiring regions, said plurality of individual electrode wirings arranged along a length of said lower substrate, each of said plurality of individual electrode wirings corresponding to a different electrode pad of each of said plurality of light emitting diode array chips.

5 more elements

Dependencies are inferred from the claim text.