Ethylene/methacrylic acid copolymers in poly(phenylene sulfide) compositions
AssigneeInternational Flavors & Fragrances Inc.
InventorNathaniel Harry, Sr.
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Abstract
A composition suitable for encapsulating articles such as small electronic devices and having improved tensile strength and other mechanical properties. The composition comprises a poly(phenylene sulfide) base resin, a non-reinforcing mineral filler and an ethylene/methacrylic acid copolymer. Also provided are a method of forming the composition and articles such as electronic components encapsulated with the composition.
Claims22
A poly(phenylene sulfide) polymer composition having improved mechanical properties upon being molded comprising:
- in the range of from about 10% to about 60% by weight of a poly(phenylene sulfide) base resin;
- in the range of from about 10% to about 70% by weight of a non-reinforcing filler for controlling the overall rate of thermal expansion of said composition;
- and in the range of from about 1% to about 10% by weight of an ethylene/methacrylic acid copolymer for improving mechanical properties of said composition.
A poly(phenylene sulfide) polymer composition for encapsulating an electronic component having improved mechanical properties upon being molded comprising:
- in the range of from about 10% to about 60% by weight of a poly(phenylene sulfide) base resin having an extrusion rate in the range of from about 120 g/10 min. to about 180 g/10 min.;
- in the range of from about 10% to about 70% by weight of a non-reinforcing mineral filler for compensating in a difference in the rate of thermal expansion of said poly(phenylene sulfide) base resin and the rate of thermal expansion of said electronic component;
- and
- in the range of from about 1% to about 10% by weight of an ethylene/methacrylic acid copolymer for improving mechanical properties of said composition.
An electronic component encapsulated with a poly(phenylene sulfide) polymer composition having improved mechanical properties, said composition comprising:
- in the range of from about 10% to about 60% by weight of a poly(phenylene sulfide) base resin having an extrusion rate in the range of from about 120 g/10 min. to about 180 g/10 min.;
- in the range of from about 10% to about 70% by weight of a non-reinforcing filler for compensating for a difference in the rate of thermal expansion of said poly(phenylene sulfide) base resin and the rate of thermal expansion of said article;
- and
- in the range of from about 1% to about 10% by weight of an ethylene/methacrylic acid copolymer for improving mechanical properties of said composition.
Dependencies are inferred from the claim text.