Pretreatment process for electroless plating of polyimides
AssigneeShipley Company, L.L.C.
InventorsJames Rychwalski, Paul J. Ciccolo, Edward C. Couble
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Abstract
A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.
Claims13
A pretreatment process for improved adhesion between a filled polyetherimide substrate and an electrolessly deposited metal thereon, said pretreatment process comprising steps of contacting said substrate with gamma-butyrolactone, followed by an aqueous rinse prior to the subsequent step of electrolessly depositing said metal.
Dependencies are inferred from the claim text.