Thick-film devices having dielectric layers with embedded microspheres
AssigneeDigital Equipment Corporation
InventorDavid Kellerman
Life of this patent
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Abstract
To produce a layer in a multi-layer circuit structure, a "green ceramic tape" (16) comprising a sheet of particles of ceramic, glass ceramic, or a glass/ceramic composite in an organic binder is applied to a ceramic substrate (12) on which conductive paths (14) have been deposited. A slurry of hollow microspheres (20) is then deposited onto the green ceramic tape (16), and pressure is applied to drive the spheres into the tape. A further tape layer (22) is then applied, and the resultant structure is fired.
Claims14
A multilayer ceramic device fabricated by a method comprising the steps of:
- A. providing a ceramic substrate;
- B. applying a metal layer to the substrate;
- C. separately applying to the ceramic substrate over the metal layer (i) a green ceramic tape and (ii) a layer of hollow microspheres;
- and
- D. firing the resultant structure.
A multilayer ceramic device fabricated by a method comprising the steps of:
- A. providing a ceramic substrate;
- B. applying a metal layer to the substrate;
- C. separately applying to the ceramic substrate over the metal layer (i) a layer of a mixture of an organic plasticizer and particles of a glass ceramic, a glass/ceramic composite, or a ceramic and (ii) a layer of hollow microspheres;
- and
- D. firing the resultant structure.
Dependencies are inferred from the claim text.