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US 5,178,743 AGranted
Cylindrical magnetron sputtering system
AssigneeMicroelectronics and Computer Technology Corporation
InventorNalin Kumar
Life of this patent
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Abstract
A system for depositing a film on a substrate includes a sputtering system and means for causing the substrate to move through the sputtering system. Embodiments of the present invention employ a cylindrical hollow cathode magnetron sputtering system, which causes the overall film deposition system to be ideally suited for coating elongate cylindrical substrates such as wires and fibers and the like.
Claims10
A cylindrical magnetron sputtering system comprising:
- a cathode structure including a cylindrical container shaped element, a top element, and means for connecting said top element to said container shaped element;
- a magnetic backing structure surrounding said cathode structure, said magnetic backing structure comprising a magnetic backing container shaped element and a magnetic backing top element, and means for connecting said magnetic backing top element to said magnetic backing container shaped element;
- an anode structure comprising two anodes, each of said anodes having a barrel portion and a flange portion, one of said two anodes disposed between said magnetic backing top element and said cathode structure, the other of said two anodes disposed between said magnetic backing container shaped element and said cathode structure, and
- an electrical insulator disposed between said magnetic backing structure and said cathode structure;
- wherein said magnetic backing top element, one of said two anodes, said cathode structure, the other of said two anodes, said electrical insulator, and said magnetic backing container shaped element all have portions defining a single, elongated void for accomodating at least one elongated substrate therein.
2 more elements
A system for depositing at least one film on an elongated moving substrate, said system comprising:
- (a) a vacuum chamber;
- (b) means for evacuating said vacuum chamber;
- (c) means for back-filling said vacuum chamber with a selected gas;
- (d) at least one heating coil disposed within said vacuum chamber;
- (e) at least one cylindrical magnetron sputtering system disposed within said vacuum chamber, said at least one cylindrical magnetron sputtering system comprising:
- (i) a cathode structure including a cylindrical container shaped element, a top element, and means for connecting said top element to said container shaped element;
- (ii) a magnetic backing structure surrounding said cathode structure, said magnetic backing structure comprising a magnetic backing container shaped element, a magnetic backing top element, and means for connecting said magnetic backing top element to said magnetic backing container shaped element;
- and
- (iii) an anode structure comprising two anodes, each of said two anodes having a barrel portion and a flange portion, one of said two anodes disposed between said magnetic backing top element and said cathode structure, the other of said two anodes disposed between said magnetic backing container shaped element and said cathode structure;
- wherein said magnetic backing top element, one of said two anodes, said cathode structure, the other of said two anodes, and said magnetic backing container shaped element all have portions defining a single, elongated void for accomodating at least one elongated substrate therein;
- and
- (f) means for causing said at least one elongate substrate to move through said vacuum chamber and thereby through said at least one heating coil and said single, elongated void of said at least one cylindrical magnetron sputtering system.
9 more elements
Dependencies are inferred from the claim text.