Method for forming semiconducting poly(arylene sulfide) surfaces
AssigneePhillips Petroleum Company
InventorsTimothy W. Johnson, Mark J. Dreiling
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Abstract
A method for coating a poly(arylene sulfide) polymer surface with a semiconductive layer for static charge dissipation and/or induction shielding comprises laminating a poly(arylene sulfide) substrate against a copper foil sheet at a temperature above the melting point of the PAS substrate, wherein the copper foil sheet has been treated with a silane selected from a specific group. When the laminate is cooled and the copper foil peeled away, a poly(arylene sulfide) substrate having a semiconductive surface coating is obtained.
Claims9
A method of coating a poly(arylene sulfide) substrate with a semiconductive layer, said method comprising:
- (a) applying onto at least one side of a copper foil an effective amount of a silane within the formula:
- ##STR3## wherein n is an integer from 1 to 30;
- wherein each of R.sub.1 and R.sub.2 is H or an alkyl group having 1 to 30 carbon atoms;
- wherein each of R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9 and R.sub.10 is an alkyl group having from 1 to 30 carbon atoms;
- wherein x is 0 or 1;
- wherein y is 0 or 1;
- and wherein each of R.sub.3 and R.sub.4 is an alkylene group having from 1 to 30 carbon atoms;
- (b) contacting the silane treated copper foil and said poly(arylene sulfide) substrate, and laminating superimposed layers of said treated copper foil and said poly(arylene sulfide) substrate at a temperature above the melting point of said poly(arylene sulfide) substrate;
- and
- (c) peeling said copper foil away from said poly(arylene sulfide) substrate.
Dependencies are inferred from the claim text.