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AssigneeCompaq Computer Corporation
InventorsEric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad C. McMillan, Jr., Rollin G. Meyer, Darryl J. McKenney
Estimating the term…
A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
A process for assembling components and devices on a rigid-flex printed circuit board in a high volume production environment utilizing an infrared reflow oven wherein rigid-flex printed circuit board includes a rigid section, a flexible section extending from the rigid section, a top spacer and a top insulating cover spaced above the flexible section, and a bottom spacer and a bottom insulating cover spaced below the flexible section, comprising the steps of:
A process for assembling components and devices on a rigid-flex printed circuit board in a high volume production environment utilizing an infrared reflow oven wherein the rigid-flex printed circuit board includes a rigid section, a flexible section extending from the rigid section, a top spacer and a top insulating cover spaced above the flexible section, and a bottom spacer and a bottom insulating cover spaced below the flexible section, comprising the steps of:
Dependencies are inferred from the claim text.