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US 5,178,315 AGranted
Soldering device for electronic elements
AssigneePioneer Electronic Corporation
InventorsMasahiko Konno, Yuji Kita
Life of this patent
Estimating the term…
Abstract
A device for soldering an electronic element to a substrate has a support head for supporting the substrate, and a pusher having a push head provided above the support head for pushing the electronic element to the substrate. The holder is upwardly moved to push the element to the substrate.
Claims4
A device for soldering an electronic element to a substrate, comprising:
- a supporting device having a holder and a support head mounted on the holder for supporting the substrate;
- a pusher having a push head provided above the support head, a lower end of said push head having an area to be abutted on a central portion of said electronic element, said push head for pushing the electronic element to the substrate;
- first driving means for vertically moving the holder;
- and
- second driving means for vertically moving the push head wherein said electronic element and said substrate are gripped by said support head and said push head which is abutted on said central portion of said electronic element.
2 more elements
Dependencies are inferred from the claim text.