Die for use in fine press working
OwnerKato Kazuhikoinventor
Life of this patent
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Abstract
The object of the invention is to reduce the number of the producing processes of an IC lead frame. In the present invention, a plurality of punches 17 are provided protruding from the base 16 in such a manner that their surfaces are disposed approximately radially, and the reinforcing punch 23 which connects the cutting blades 18 of the punches 17 with each other, is provided between the cutting blades 18, and protruding from the base 16. The punches 17 are integrated by the reinforcing punch 23, so that the strength of each punch 17 is improved and the number of punched holes in one process can be increased.
Claims8
A die for fine process working, having a male die and a female die, said male die comprising a base pad, a reinforcing punch extending from said base pad and having an elongate cutting face, a plurality of punches extending from said base pad, said plurality of punches having elongate cutting faces which are connected to, and extend from, said reinforcing punch elongate cutting face, said base pad having slots communicating with spaces between said plurality of punches, said slots being in line with said spaces between said plurality of punches to allow for passage of a wire capable of machining said punches, said female die comprising a plurality of holes into which said plurality of punches can be inserted, and a lateral hole into which said reinforcing punch can be inserted.
A die for fine process working according to claim 3, 4, 5, 6 or 7, wherein fine holes punched in said work piece plate are lead frames applied for IC chips.
Dependencies are inferred from the claim text.