Manufacturing method of magnetic head
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsShinsuke Yura, Mitsuo Inumochi, Tomohiro Fukuichi
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Abstract
A manufacturing method of a magnetic head wherein forming plural belleville springs in the same arrangement as that of plural head sliders formed on a single slider wafer and bonding the belleville springs to the slider wafer, then cutting the slider wafer into individual head sliders thereby to obtain many head sliders having the belleville springs respectively.
Claims14
A manufacturing method of a magnetic head which includes a head slider for lifting a head element off a recording medium, and a suspension member for suspending the head slider from an arm of an actuator for actuating the magnetic head, comprising the steps of:
- providing a single wafer having a plurality of head sliders disposed in a predetermined positional arrangement;
- forming a plurality of suspension members in a positional arrangement matching that of the head sliders;
- bonding the plurality of suspension members formed in said arrangement to said wafer;
- and
- cutting said wafer bonded with said suspension members into a plurality of individual head sliders each provided with a suspension member.
A manufacturing method of a magnetic head which includes a head slider for lifting a head element including a lead off a recording medium, and a suspension member for suspending the head slider from an arm of an actuator for actuating the magnetic head, comprising the steps of:
- providing a single wafer having a plurality of head sliders in a predetermined positional arrangement, each head slider provided with a solder bump;
- forming in a positional arrangement matching that of the head sliders a plurality of suspension members each constituted by a bonding part with a solder bump and a spring part arranged in the periphery of the bonding part;
- forming a conductor on said each suspension member;
- bonding the plurality of suspension members formed in said arrangement to said wafer by bonding said solder bumps of said plurality of head sliders with said solder bumps of said plurality of suspension members, wherein a conductive path is simultaneously formed for each head slider suspension member pair constituted by said conductor and said lead;
- and
- cutting said wafer bonded with said suspension members into a plurality of individual head sliders each provided with a suspension member.
Dependencies are inferred from the claim text.