Thermal conduction module with integral impingement cooling

A thermal conduction module comprising a substrate having a chip-carrying surface;

• a plurality of integrated circuit chips arrayed in rows on said substrate;
• a piston for cooling said chips, said piston having an end in thermal contact with said chips, said piston end being formed from a layer of thermally conductive material having alternate open bottom and open top channels extending across said layer, said open bottom channels being between adjacent rows of said chips and said open top channels being directly over said chips, said piston including passages for directing coolant between adjacent open top channels and internal members for directing coolant into said open top channels;
• and an inlet and outlet on said piston for a coolant.

A thermal conduction module comprising a substrate having a chip-carrying surface;

• a plurality of integrated circuit chips arrayed in rows on said substrate;
• a piston for cooling said chips, said piston having an end in thermal contact with said chips, said piston end being formed from a layer of thermally conductive material having rows of spaced, open top, cup-shaped depressions extending across said layer, each depression corresponding to and disposed over one of said chips, said depressions being spaced from one another by open bottom channels formed in said layer between adjacent rows of said chips, said piston including passages for directing coolant between adjacent rows of said cup-shaped depressions and internal members for directing coolant into said depressions;
• and an inlet and outlet on said piston for a coolant.