Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsKatsuhisa Homma, Masaru Nikaido, Yoshiaki Ouchi, Mutsuki Yamazaki, Shuji Yoshizawa
Estimating the term…
A layer of an amorphous substance containing at least one member from among hydrogen and halogen elements and using as main components thereof silicon and at least one member selected from among nitrogen, carbon, and oxygen is formed as a resin-protecting layer or an abrasion-resistant layer in a thermal printing head or as a resin-protecting layer in a heat-resistant insulating substrate. The hardness of the substrate itself is greatly improved by this layer of the amorphous substance. As the result, the substrate as a whole or the thermal printing head as a whole acquires high rigidity and improved resistance to crack.
A thermal printing head, having crackproofness against local pressure caused by entrapping foreign matter, comprising, a highly thermoconductive supporting substrate, a heat-resistant resin layer formed on the supporting substrate, a resin-protecting layer formed on the heat resistant resin layer, a plurality of heat-generating resistor members formed on the resin-protecting layer, conductors connected to the heat-generating resistor members, and an abrasion-resistant layer covering at least a heat-generating portion of the heat-generating resistor members, the abrasion-resistant layer being formed of at least one amorphous layer selected from the group of a-SiO layer, a-SiN layer and a-SiC layer, and the amorphous layer further containing at least one element selected from the group consisting of hydrogen and halogen, said abrasion-resistant layer having a thickness of 2 to 8 .mu.m.
A thermographic recording apparatus comprising a thermosensitive recording paper, conveyor means for conveying the thermosensitive recording paper, a thermal printing head for producing prints on the thermosensitive recording paper, the thermal printing head including a highly thermoconductive supporting substrate, a heat-resistant resin layer formed on the supporting substrate, a resin-protecting layer formed on the heat-resistant resin layer, a plurality of heat-generating resistor members formed on the resin-protecting layer, conductors connected to the heat-generating resistor members, and an abrasion-resistant layer covering at least heat-generating parts of the heat-generating resistor members, the abrasion-resistant layer being formed of at least one amorphous layer selected from the group of a-SiO layer, a-SiN layer and a-SiC layer, and the amorphous layer further containing at least one element selected from the group consisting of hydrogen and halogen, driving means for driving the heat-generating resistor members in accordance with recording signals, and data processing means for supplying the recording signals to the driving means, said abrasion-resistant layer having a thickness of 2 to 8 .mu.m.
Dependencies are inferred from the claim text.