High-density optically-addressable circuit board probe panel and method for use

A probe apparatus for testing circuit boards comprising:

• first and second probe panels for providing addressable lines to a circuit board under test, said first and second panels having a first plurality (N) of strips, and each strip having a second plurality (M) of electrodes to form an electrode array;
• coupling means for selectively coupling said electrodes of said strips to a plurality of said addressable lines;
• switching means coupled between each one of said electrodes and one of said strips, said switching means comprising photoelectric switches sensitive to incident photoelectric energy to conduct between said strip and said electrode;
• and
• means for selectively photoelectrically activating said photoelectric switches.

A method for testing a bare or partially assembled circuit board having a plurality of nodes, said method comprising the steps of:

• preparing an address matrix of selected locations conforming to positions on said circuit board;
• reproducing said address matrix on a light valve means;
• programming a set of multiplexing means on a photoelectrically addressable probe panel to address preselected data lines connected to selected multiplexing means for performing a specified function, each said data line being coupled to at least one electrode via a photoelectric switch;
• and
• passing photoelectric energy through said light valve means onto said probe panel to activate a pattern of said electrodes based on said selected locations of said address matrix, thereby electrically activating a pattern of said nodes having a form factor substantially complying with said address matrix.

A method of testing a bare or partially assembled circuit board having a plurality of nodes, said method comprising the following steps:

• creating an image of an array of addressable locations corresponding to selected ones of said nodes as an optical address matrix;
• projecting said optical address matrix upon a panel comprising a matrix of photoelectric switches to cause switching of said matrix of photoelectric switches to apply a signal to said selected nodes via a first group of electrodes connected to said photoelectric switches by photoelectric application of said optical address matrix to said photoelectric switch matrix;
• and
• detecting a response to said signal via a second group of electrodes connected to said photoelectric switches through said photoelectric switch matrix which has been enabled by said optical address switch matrix.