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US 5,177,176 AGranted
Soluble pseudo rod-like polyimides having low coefficient of thermal expansion
AssigneeE. I. Du Pont de Nemours and Company
InventorBrian C. Auman
Life of this patent
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Abstract
Polyimide compositions, films, and electronic devices using polyimides, based on 9-aryl-9(perfluoroalkyl)-xanthene-2,3,6,7-dianhydride and one or more diamines from a selected group, which offers to the polyimides a combination of desirable properties including solubility, pseudo rod-like structure, low linear coefficient of thermal expansion, high glass transition temperature, low dielectric constant, and high modulus.
Claims8
A polyimide comprising the structure:
- ##STR4## wherein R1 is aryl
- R2 is -CnF2n+1,
- N is an integer 1-3
- R3 is selected from the group consisting of ##STR5## with the requirement that the polyimide is soluble at a level of at least 1% by weight in at least one organic solvent selected from the group consisting of dimethylsulfoxide, diethylsulfoxide, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide, N-methyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, 1,3-dimethyl-2-imidozolidione, N-vinyl-2-pyrrolidone, phenol, o-, m-, p-cresol, xylenol, halogenated phenol, catechol, hexamethylphosphoramide, .gamma.-butyrolactone, chloroform, tetrachloroethane, halogenated hydrocarbon, mixtures thereof, and
- has a coefficient of thermal expansion of less than 25 ppm.
2 more elements
A film comprising a polyimide, which polyimide comprises the structure:
- ##STR7## wherein R1 is aryl
- R2 is -CnF2n+1,
- N is an integer 1-3
- R3 is selected from the group consisting of:
- ##STR8## with the requirement that the polyimide is soluble at a level of at least 1% by weight in at least one organic solvent selected from the group consisting of dimethylsulfoxide, diethylsulfoxide, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide, N-methyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, 1,3-dimethyl-2-imidozolidione, N-vinyl-2-pyrrolidone, phenol, o-, m-, p-cresol, xylenol, halogenated phenol, catechol, hexamethylphosphoramide, .gamma.-butyrolactone, chloroform, tetrachloroethane, halogenated hydrocarbon, mixtures thereof, and
- has a coefficient of thermal expansion of less than 25 ppm.
3 more elements
Dependencies are inferred from the claim text.