Tacking agent

A tacking agent suitable for temporarily fixturing electronic components and serving as a solder flux, consisting essentially of;

• a carboxylic acid compound having the property of vaporizing or decomposing at temperatures between ambient and 300.degree. C., in an amount effective to serve as a solder flux;
• one or more alcohol thickeners having one or more hydroxyl groups, suitable for forming a viscous solution or suspension of the carboxylic acid compound, said viscous solution having a viscosity of between 20 and about 1500 centipoise, and said alcohol thickener also serving as a fugitive solvent by vaporizing or decomposing between said temperatures;
• and
• an electrically non-conducting encapsulant material having a melting point between about 45 and about 260 degrees C.

A tacking agent suitable for temporarily fixturing electronic components and serving as a solder flux, consisting essentially of;

• a carboxylic acid compound having the property of vaporizing or decomposing at temperatures between ambient and 300.degree. C., in an amount effective to serve as a solder flux;
• one or more alcohol thickeners having one or more hydroxyl groups, suitable for forming a viscous solution or suspension of the carboxylic acid compound, said viscous solution having a viscosity of between 20 and about 1500 centipoise, and said alcohol thickener also serving as a fugitive solvent by vaporizing or decomposing between said temperatures;
• and
• a photodegradable polymer.

A tacking agent for use in temporarily adhering components and serving as a solder flux, consisting essentially of;

• a fluxing agent composed of a dicarboxylic acid compound having the formula ##STR3## where R is an alkyl group containing from 1 to 6 carbon atoms, R' is selected from the group consisting of hydrogen and hydroxyl, and R" is selected from the group consisting of hydrogen, hydroxyl and carboxyl;
• and wherein the proportion of the dicarboxylic acid ranges from about 0.1 to about 10 weight percent of the tacking agent;
• a tackifier suitable for forming a viscous solution or suspension of the dicarboxylic acid, comprising one or more materials selected from the group consisting of;
• alcohols having the formula R--OH or HO--R--OH, where R is an alkyl group containing from 1 to 12 carbon atoms, or R is an aromatic group;
• a material selected from the group consisting of polyisobutylene, polyacrylates, alpha-substituted polyesters, polyterpenes, and organic carbonates;
• and
• aromatic hydrocarbon solvents and aliphatic hydrocarbon solvents;
• and
• an electrically non-conducting encapsulant material having a melting point between about 45 and about 260 degrees C.

A tacking agent for use in temporarily adhering components and serving as a solder flux, consisting essentially of;

• a fluxing agent composed of a dicarboxylic acid compound having the formula ##STR4## where R is an alkyl group containing from 1 to 6 carbon atoms, R' is selected from the group consisting of hydrogen and hydroxyl, and R" is selected from the group consisting of hydrogen, hydroxyl and carboxyl;
• and wherein the proportion of the dicarboxylic acid ranges from about 0.1 to about 10 weight percent of the tacking agent;
• a tackifier suitable for forming a viscous solution or suspension of the dicarboxylic acid, comprising one or more materials selected from the group consisting of;
• alcohols having the formula R--OH or HO--R--OH, where R is an alkyl group containing from 1 to 12 carbon atoms, or R is an aromatic group;
• a material selected from the group consisting of polyisobutylene, polyacrylates, alpha-substituted polyesters, polyterpenes, and organic carbonates;
• and
• aromatic hydrocarbon solvents and aliphatic hydrocarbon solvents;
• and
• a photo-degradable polymer.

A tacking agent for use in soldering electronic assemblies, comprising:

• malic acid, where the proportion of malic acid ranges from about 0.1 to about 10 weight percent of the tacking agent;
• a thickener selected from the group consisting of polyisobutylene, polyacrylates, alpha-substitute polyesters, polyterpenes, and organic carbonates;
• and
• a solvent suitable for forming a viscous solution or suspension of the malic acid and the thickener, said viscous solution or suspension having a viscosity of between about 20 and about 1500 centipoise, the solvent vaporizing while soldering the electronic assemblies.