Gold plating bath additives for copper circuitization on polyimide printed circuit boards
AssigneeInternational Business Machines Corporation
InventorsLeann G. Keim, Ralph S. Paonessa, Daniel C. Van Hart
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Abstract
Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the selected portions of the polyimide substrate, and thereafter depositing a gold thin film of selected portions of the copper circuitization layer. The gold thin film is electrodeposited from an electrodeposition solution of KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, modified by the addition of an effective amount of NH.sub.4.sup.+.
Claims11
In a method of fabricating a microelectronic package having gold plated copper circuitization on a dielectric substrate comprising forming copper surface circuitization on the dielectric substrate, and thereafter electrodepositing gold on the copper circuitization from an electroplating solution, the improvement where said electroplating solution comprising KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, and further (contains) containing an effective amount of ammonium ion to reduce adhesion loss between the copper circuitization and the substrate.
In a method of fabricating a microelectronic package having gold plated copper circuitization on a polyimide substrate comprising forming copper surface circuitization on the polyimide substrate, and thereafter electrodepositing gold on the copper circuitization from an electroplating solution comprising KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, the improvement where said electroplating solution further contains at least about 0.1 equivalent of NH.sub.4.sup.+ per liter to reduce adhesion loss between the copper circuitization and the substrate.
In a method of fabricating a microelectronic package having gold plated copper circuitization on a polyimide substrate comprising forming copper surface circuitization on the polyimide substrate, and thereafter electrodepositing gold on the copper circuitization from an electroplating solution comprising about 20 grams/liter KAu(CN).sub.2, about 40 grams per liter K.sub.2 HPO.sub.4, and about 10 grams per liter KH.sub.2 PO.sub.4, the improvement where said electroplating solution contains at least about 0.1 equivalent of NH.sub.4.sup.+ per liter to reduce adhesion loss between the copper circuitization and the substrate.
Dependencies are inferred from the claim text.