Method of bonding polyimide films and printed circuit boards incorporating the same
AssigneeGurit-Essex AG
InventorsHerbert Schreiber, Wolfgang Saur
Life of this patent
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Abstract
An adhesive having a content of a thermically curable oxazene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule, optionally in combination with at least one curable epoxy compound, is used for bonding polyimide films to films of the same kind or to other substrates, particularly metal foils. Such bondings are highly heat-resistant and have an excellent peeling resistance. Therefore, they are suitable for the manufacture of printed circuit boards having high thermal stability and peeling resistance.
Claims35
A method for bonding two objects, at least one of which being a polyimide film, said method comprising the steps of:
- (a) applying a thermically curable oxazene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule as an adhesive to the surface of at least one of the objects;
- (b) contacting the two objects to be bonded together;
- and
- (c) thereafter thermically curing said oxazene resin.
A method for bonding two objects, at least one of which being a polyimide film, said method comprising the steps of:
- (a) applying a mixture of a thermically curable oxazene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule and of a curable epoxy resin as an adhesive to the surface of at least one of the objects;
- (b) contacting the two objects to be bonded together;
- and
- (c) thereafter thermically curing said resin mixture.
A printed circuit board consisting of a polyimide carrier film and of a metal foil, said metal foil being bonded to said carrier film by means of a cured oxazene resin.
A printed circuit board consisting of a polyimide carrier film and of a metal foil, said metal foil being bonded to said carrier film by means of an oxazene resin cured in combination with at least one epoxy compound.
Dependencies are inferred from the claim text.