Paste solder with minimized residue
AssigneeSenju Metal Industry Co., Ltd.
InventorToshihiko Taguchi
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Abstract
A paste solder with minimized flux residue remaining after soldering comprises a powdered solder and a flux in admixture. The flux comprises from about 5% to about 40% by weight of carrier components which comprise a rosin or a rosin derivative, an activating agent, and a thixotropic agent and from about 60% to about 95% by weight of a solvent which predominantly comprises a 2-alkyl-1,3-hexanediol having 1 to 4 carbon atoms in the alkyl group.
Claims14
A paste solder with minimized residue which comprises a powdered solder and a flux in admixture, wherein the flux comprises from about 5% to about 40% by weight of carrier components which comprise a rosin or a rosin derivative as a main fluxing agent, an activating agent, and a thixotropic agent and from about 60% to about 95% by weight of a solvent which predominantly comprises a 2-alkyl-1,3-hexanediol having 1 to 4 carbon atoms in the alkyl group.
Dependencies are inferred from the claim text.