Selective flow soldering apparatus

Apparatus for mounting and electrically coupling a plurality of electronic components in a spaced manner to a PC board, wherein each of said electronic components includes an array of conductive pins, said apparatus comprising:

• a flux station for applying a flux material to designated areas arranged in a spaced manner on a first surface of the PC board corresponding to the location of each of the electronic components, said flux station including a plurality of spaced flux nozzle means for alignment with an associated electronic component or components, and wherein each flux nozzle means is configured and sized in accordance with the array of conductive pins of a respective one or more of the electronic components;
• load station for positioning each of the electronic components on a second, opposed surface of the PC board such that the conductive pins of each electronic component are inserted in and extend through apertures in the PC board;
• and
• a soldering station for applying solder over said flux material at each of said designated areas of the PC board in mounting and electrically coupling the electronic components in a spaced manner to the PC board, said soldering station including a plurality of spaced solder nozzle means for alignment with an associated electrical component or components, and wherein each solder nozzle means is configured and sized in accordance with the array of conductive pins of a respective one or more of the electronic components.