Dual contact beam assembly for an IC test fixture

A dual contact beam assembly apparatus for at-speed testing of integrated circuits, comprising:

• a first non-conducting, substantially rigid template having a plurality of holes arranged in a pattern;
• a second non-conducting, substantially rigid template having a plurality of holes arranged in a pattern similar to said first template;
• spacer means for maintaining a predetermined distance between said first template and said second template;
• an electrically non-conducting filler to be placed between said first and second templates, said filler having a plurality of holes arranged in a pattern similar to said first plate;
• means for attaching said spacer means to said first and second templates;
• a plurality of wire beams which compress and deform elastically, one of said beams being placed within each of said holes and arranged in said pattern on said templates, said beams protruding out of said holes of said first template, said second template;
• and said filler and
• means for alignment of said first template and said second template, wherein said means for alignment further includes:
• said first template and said second template each include at least one alignment aperture;
• said first template and said second template each include an orientation identifier;
• and
• at least one alignment pin for placement in said alignment aperture.