Process for the production of a circuit arrangement on a support film
OwnerFritz Pichlinventor
Life of this patent
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Abstract
The circuit arrangement has at least one electrically conductive cut conductor track on at least one surface of a support film, the support film being free of deformations and fluctuations in the thickness, both in the region of the conductor track covering it and outside this region. The edges of the conductor track have a projection in the form of a stamping burr. A negative circuit is applied to a stamping substrate or embossed in the latter by means of embossing dies or punching tools constituting a block; the conductor track representing the remaining positive circuit is transferred to the support film.
Claims19
A process for placing a conductive foil having a predetermined shape on a support film, comprising the steps of:
- locating a conductive foil adjacent to a stamping substrate;
- stamping the conductive foil so as to separate a negative portion of said conductive foil from a remaining positive portion having said predetermined shape, and to embed said negative portion in said stamping substrate while partially compressing said stamping substrate beneath said negative portion;
- and then
- transferring said positive portion to said support film.
Dependencies are inferred from the claim text.