Slicing machine and a slicing method by the same
AssigneeTokyo Seimitsu Co., Ltd.
InventorsIchiro Katayama, Yoshio Kamoshita
Life of this patent
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Abstract
A slicing method includes slicing an ingot by a rotary blade while the inner peripheral cutting edge of the blade is kept in a highly rigid state. A slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade, where an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.
Claims13
A slicing method in which a crystal ingot is sliced into thin pieces by the inner peripheral cutting edge of a doughnut-shaped rotary blade, said slicing method comprising the steps of:
- applying an axial force to said rotary blade prior to starting of said slicing to thereby displace the cutting edge of said rotary blade in the axial direction thereof, by applying air pressure to the blade to control the displacement of the rotary blade;
- and
- slicing said crystal ingot while said blade is displaced wherein said axial displacement of the rotary blade is achieved by varying a clearance between an air pad an said rotary blade with the pressure of the air jetted out from said air pad to said rotary blade being constant.
A slicing method by use of a slicing machine in which an outer peripheral cutting edge of a doughnut-shaped rotary blade is mounted by stretching onto a chuck body and an ingot is sliced into thin wafers by an inner peripheral cutting edge of the rotary blade, the slicing method comprising the steps of:
- applying an axial force in a vicinity of the inner peripheral cutting edge of the rotary blade prior to slicing, controlling said axial force by a control unit, said axial force causing a displacement of the rotary blade in the vicinity of the inner peripheral cutting edge, said displacement providing a rigid inner peripheral cutting edge;
- sensing the displacement
- storing the displacement in the control unit as a reference position of the rotary blade;
- and
- slicing the ingot into thin wafers while the rotary blade is displaced.
Dependencies are inferred from the claim text.