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US 5,167,851 AGranted
Hydrophilic thermally conductive grease
AssigneeThermoset Plastics, Inc.
InventorsWilliam L. Jamison, Gary J. Larsen, George E. Sears, Jr.
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AssigneeThermoset Plastics, Inc.
InventorsWilliam L. Jamison, Gary J. Larsen, George E. Sears, Jr.
Estimating the term…
A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic liquid polymer carrier, an antioxidant, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.
In a method for reversible thermal coupling of one or more operating components of an electronic device with an adjacent heat sink by selecting and applying a thermally conductive thixotropic composition in contact with both said operating components and said heat sink, the improvement which comprises selecting and applying a thermally conductive composition formulated as a water washable thermally conductive grease comprising
In a method for reversible thermal coupling of one or more operating components of an electronic device with an adjacent heat sink by selecting and applying a thermally conductive thixotropic composition in contact with both said operating component and said heat sink, the improvement which comprises applying a water-washable thermally conductive grease in contact with said operating components and said heat sink, said thermally conductive grease comprising about 10 to about 70 weight percent of a hydrophilic fluid carrier;
Dependencies are inferred from the claim text.