Transfer molded semiconductor device package with integral shield

A shielded semiconductor device package including a radio frequency shield for at least one semiconductor device, comprising:

• an insulating substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a plurality of solderable surface mount pads, the metallization pattern being electrically connected to the surface mount pads by means of at least one plated through hole, and having the semiconductor device mechanically attached and electrically interconnected thereto;
• a non-conductive material encapsulating the semiconductor device, the electrical interconnections, and portions of the first side of the substrate;
• and
• a metal screen enclosing the semiconductor device and covering a portion of the first side of the substrate and electrically coupling the substrate and the metal screen to provide a shield for substantially reducing the ingress or egress of radio frequency signals through the semiconductor device package.