Plastic molding device for a semiconductor element
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsMinoru Tanaka, Itaru Matsuo
Life of this patent
Estimating the term…
Abstract
A plastic molding device for a semiconductor element for plastic molding a semiconductor element on a lead frame, which comprises: an upper platen, a lower platen, and a movable platen movably provided at a tie bar which is provided between said two platens; an upper metal mold and a lower metal mold provided at the upper platen and the movable platen, respectively; a motor for applying a raising force for driving the movable platen; a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force; and a double toggle mechanism for giving the reciprocative force to the movable platen.
Claims1
A plastic molding device for plastic molding a semiconductor element on a lead frame comprising:
- an upper platen, a lower platen, and a movable platen which are all interconnected by at least one tie bar;
- an upper metal mold and a lower metal mold provided on the upper platen and the movable platen, respectively;
- a motor for outputting a rotation force;
- a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force to enable reciprocation of said movable platen toward said upper platen;
- and
- a spring for urging the movable platen toward said upper platen, said spring being provided between the lower platen and the movable platen.
Dependencies are inferred from the claim text.