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US 5,163,005 AGranted
Method of cloning printed wiring boards
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorsSteven D. Greene, Michael C. Ford, Douglas A. Froom, Rodney E. Wagner
Life of this patent
Estimating the term…
Abstract
A method of cloning printed wiring boards by milling one side of the board to a minimum thickness, then X-raying the board to produce a film negative. This negative is photographed to provide a reversed negative which is converted to a diazo photograph.
Claims11
A method of cloning printed wiring boards comprising the steps of:
- a) removing all components from the printed wiring boards,
- b) drilling holes and routing component interconnection points on said printed wiring boards,
- c) milling the opposite sides of said printed wiring boards to a predetermined thickness,
- d) exposing said printed wiring boards to radiography to produce a film negative,
- e) photographing said film negative to provide a reversed film, and
- f) converting said reversed film to a diazo photograph.
3 more elements
A method of cloning a printed circuit wiring board, said board to be cloned having components on both sides thereof, and having component interconnection points thereon, comprising the steps of:
- a. removing all components from first and second identical printed wiring boards which are to be clones;
- b. drilling holes and routing component interconnection points on each of said printed wiring boards;
- c. milling one side of the first of said boards to a predetermined depth to remove all of the wiring on said one side;
- d. milling opposite side of the second of said boards to a predetermined depth to remove all of the wiring on said opposite side;
- e. exposing each of said printed wiring board to radiograph to produce a film negatives of each of said boards;
- f. photographing said film negatives to provide reversed films;
- and
- g. converting said reversed films to a diazo photograph.
5 more elements
Dependencies are inferred from the claim text.