Device for encapsulating electronic components
AssigneeBoschman Technologies B.V.
InventorsJosephus J. M. Schraven, Marinus B. J. de Kruijff, Maarten Hoekstra
Life of this patent
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Abstract
A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.
Claims11
A device for encapsulating electronic components with a synthetic resin, said device comprising:
- a mold including an upper mold part and a lower mold part, said parts forming a plurality of mold cavities, a plurality of plunger pots and injection gates each coupled to a corresponding different cavity, heating means for heating the mold, a frame reciprocally movable relative to the mold, a plurality of plungers coupled to the frame and movable in the plunger pots, each plunger corresponding to a different pot for forcing mold material from that pot to a cavity via a gate, spring means engaged with each said plungers, said plungers each displacing in response to a resilient load created by said spring means, drive means for moving the frame and the corresponding coupled plungers in a first direction relative to the mold, and locking means movable in a second direction transverse to the first direction between an operational position and an idle position, the plungers being fixed relative to the frame in the operational position of the locking means and being loaded by the springs in the idle position of the locking means.
Encapsulation apparatus for electronic components comprising:
- a mold comprising upper and lower mold parts having an ejection state and a mold state, at least one of which parts including a plurality of cavities each for encapsulating a component with a synthetic resin in a mold cycle;
- a plurality of plunger pots secured to at least the other of said parts, each pot for receiving solidified resin, said pots each being coupled in at least the mold state via a corresponding injection gate to a corresponding cavity;
- means for heating the mold for melting said received solidified resin;
- a frame reciprocally movable relative to at least said other of said parts;
- a plurality of plungers coupled to the frame, each plunger corresponding to and engaged with a different plunger pot for displacement in a first direction relative to said engaged pot for applying pressure to said received resin to force the molten resin into the corresponding cavity via said corresponding gate;
- drive means for displacement of the frame and plungers relative to said at least one part;
- and
- locking means displaceable in a second direction transverse to first direction and having a locking position and an idle position for locking the plungers relative to the frame in the locking position in one portion of a mold cycle and for resiliently loading said plungers relative to said frame in a second portion of the mold cycle.
Dependencies are inferred from the claim text.