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AssigneesHong-Ping Wu, Ying-Ru Wang, Michael Ferris, Shao-Hong Wan, Xiao Q. Chen
InventorsHong-ping Wu, Ying-Ru Wang
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A composite semiconductive thermoelectric refrigerating module comprises dozens or hundreds composite P-N couples which are electrically connected in series to form an array of required configuration which is fixed with electrical and thermal insulator and combined with the heat absorber and a thermal radiator, respectively, by thermoconductive greased films of electrical insulation. The refrigerating device is characterized by a good conductor sandwiched between the semiconductor head parts of a thermoelectric element by surface-to-surface brazing. This device can be substituted for small sized vapor compression refrigerating devices. The first embodiment of the invention is of circular configuration, while the second embodiment is rectangular. Other embodiments of specific configurations in accordance with requirements can also be constructed.
A composite semiconductor thermoelectric element for use in a thermoelectric module assembly for transfering heat between a hot and a cold junction, said element comprising two semiconductor layers of like type, each said layer having inner and outer surfaces and having interposed between said inner surfaces a good thermoconductive and electroconductive member, said member being joined to the two semiconductor layers by surface to surface brazing, said outer surfaces each to be connected to an electrical conductor.
A composite semiconductor thermoelectric element for use in a thermoelectric module assembly for transferring heat between a hot and a cold junction, said element comprising two semiconductor layers of like type, each of said layers having inner and outer surfaces and having interposed between said inner surfaces a good thermoconductive and electroconductive member, said member being joined to the two semiconductor layers by surface to surface brazing, said outer surfaces each to be connected to an electrical conductor;
A thermoelectric module refrigerating assembly comprising a plurality of composite semiconductor thermoelectric elements connected in series electrically and in parallel thermally for transferring heat between a hot and a cold junction, said composite elements each comprising two semiconductor layers each of like type having inner and outer surfaces, and having interposed between said inner surfaces a good thermoconductive and electroconductive member, said member being joined to the two semiconductor layers by surface to surface brazing, said outer surfaces each being brazed to strips of an electrical conductor, said strips being connected electrically in series.
A thermoelectric module refrigerating assembly comprising a plurality of composite semiconductor thermoelectric elements connected in series electrically and in parallel thermally for transferring heat between a hot and a cold junction, said composite elements each comprising two semiconductor layers, each of like type having inner and outer surfaces, and having interposed between said inner surfaces a good thermoconductive and electroconductive member, said member being joined to the two semiconductor layers by surface to surface brazing, said outer surfaces each being brazed to strips of an electrical conductor, said strips being connected electrically in series;
A thermoelectric module refrigerating assembly comprising:
A P and N type of thermoelectric element formed by a composite material, comprising:
Dependencies are inferred from the claim text.