Integrated circuit package with laminated backup cell

An electronic circuit package comprising, in combination:

• a molded body of insulating material;
• a lead frame assembly encapsulated within said body of insulating material, said lead frame assembly including multiple conductive finger leads and a die paddle;
• an electronic circuit device mounted on said die paddle, said electronic circuit device having positive and negative input power nodes;
• a laminated battery mounted on said lead frame assembly beneath said die paddle, said laminated battery having an electrolyte core sandwiched between a cathode lamination and an anode lamination;
• a laminated interconnect media having a central conductive laminate sandwiched between first and second insulation laminates, with a section of the first insulation laminate being removed, said laminated interconnect media being folded about the cathode and anode battery laminations, with a selected one of the battery anode and cathode laminations being mounted in electrical contacting engagement against the exposed surface of the conductive laminate, and the other battery lamination being overlapped by the opposite end of the interconnect media;
• and,
• a plurality of wire conductors coupled to the interconnect media and to the positive and negative input power nodes.