Shielded low-profile electronic component assembly

An electronic component assembly, comprising:

• an electronic component having a plurality of terminals:
• an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern:
• the electronic component affixed to the one major surface of said electronic component carrier:
• and
• a metallized shield attached to the ground pad pattern and substantially covering the electronic component:
• the metallized shield including a recessed area overlying the electronic component allowing the recessed area to be closer to the electronic component.

An electronic component assembly, comprising:

• an electronic component having a plurality of terminals;
• an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern;
• the electronic component affixed to the one major surface of the electronic component carrier;
• an encapsulant material overmolded over the electronic component and substantially covering the one major surface area where the electronic component is affixed to, and having a portion of the at least one ground pad pattern not overmolded with encapsulant;
• and
• a metallized shield attached to the at least one ground pad pattern and substantially covering the overmolded encapsulant material.

An electronic component assembly, comprising:

• an electronic component having a plurality of terminals;
• an electronic component carrier including a substrate having a major surface having peripheral edge sides and a conductive pattern on the major surface for receiving the electronic component, and at least one ground pad pattern located on the major surface;
• the electronic component affixed to the major surface of said electronic component carrier;
• and
• a metallized shield attached to the ground pad pattern and substantially covering the electronic component, the metallized shield formed from a single piece of metal and having a shield land area which rests on the major surface of the substarte upon the metallized shield being attatched to the substrate, the metallized shield further having a shield overhang which substantially overhangs the substrate peripherial edge sides.