Method for heat-processing semiconductor device and apparatus for the same
AssigneesTokyo Electron Limited, Tokyo Electron Kyushu Limited
InventorsKimiharu Matsumura, Hiroyuki Sakai, Masaaki Murakami, Tetsuya Oda, Chizo Yamaguchi
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Abstract
CPU stores information showing a time-temperature relationship and applicable for either heating a semiconductor wafer to a hold temperature for a predetermined period of time or cooling the wafer from the hold temperature over a predetermined period of time, or for both, read the information. A conductive thin film heats the wafer in accordance with the information. A sensor detects the temperature of the wafer. A control system controls either the heating of the wafer or the cooling thereof, or both, in accordance with the detected temperature signal and the information.
Claims12
A method of heat-processing an object, comprising the steps of;
- disposing an object on a stage having heating means and cooling means;
- storing in a storing means, recipe information including temperature-time points in a heating step for heating said object from ambient temperature to a process temperature, a cooling step for cooling the object from said process temperature to ambient temperature, and a processing step during which the process temperature is maintained;
- cooling the object with said cooling means, while heating the object with a conductive thin film of said heating means;
- detecting the temperature of the object directly or indirectly;
- reading the information of the recipe from the storing means;
- controlling at least one of an increase and decrease of the object temperature in accordance with the detected temperature and the recipe information.
An apparatus for heat-processing an object, comprising:
- a stage including heating means and cooling means, said heating means comprising a conductive thin film for heating the object;
- detecting means for detecting temperatures of the object on the stage;
- storing means for storing recipe information, said recipe information comprising temperature-time points in a heating step for heating said object from ambient temperature to a process temperature, a cooling step for cooling the object from said process temperature to ambient temperature, and a processing step during which the process temperature is maintained;
- and
- process control means for controlling the heating and cooling means in accordance with the time-temperature recipe information and temperature of the object.
Dependencies are inferred from the claim text.