Apparatus for wiring semiconductor device using energy beam and wiring method by using the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorHiroaki Morimoto
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Abstract
Disclosed are an apparatus for wiring a semiconductor device and a wiring method therefor which allow a manufacturing step to be simplified without deteriorating an insulation characteristic of an aerial wiring. The semiconductor device wiring apparatus includes a first beam column 1a disposed above a substrate 50 and a second beam column 1b disposed horizontally thereto. Therefore, a wiring portion of the aerial wiring to be formed upwardly is formed by using the first beam column 1a and a wiring portion to be formed horizontally to wiring layer of the substrate 50 is formed by using the second beam column, which results in that no insulating film for the aerial wiring is required to simplify manufacturing steps.
Claims9
A semiconductor device wiring apparatus for forming a wiring on a semiconductor device through irradiation with an energy beam by supplying such a reactive gas as forms a conductive material constituting a wiring by irradiation with an energy beam, said semiconductor device wiring apparatus comprising:
- first beam generating means for generating said first energy beam,
- first beam emitting means for emitting the first energy beam generated by said first beam generating means to form a first wiring,
- second beam generating means for generating a second energy beam disposed at such a position that the emission direction of the same crosses the emission direction of the first energy beam generated from said first beam generating means,
- second beam emitting means for emitting the second energy beam generated from said second beam generating means to form a second wiring on the side surface of said first wiring, and
- emission controlling means for controlling said first and second beam emitting means to control irradiation operations with said first and second energy beams.
Dependencies are inferred from the claim text.