Printed-wireboard photoimaging
AssigneeElf Atochem North America, Inc.
InventorsPaul L. K. Hung, John Cioffi, Mark L. Lavach
Life of this patent
Estimating the term…
Abstract
An improvement in the preparation of printed circuits comprises inserting a deformable layer between the phototool or support layer, and the solder mask. The deformable layer provides a uniform, integral and relatively thin coating of solder mask over circuit components, and results in higher-quality solder joints and lower rejection rates for finished boards.
Claims2
In apparatus for treating a printed wireboard with a solder mask, the board having circuit portions with a design topography disposed thereon, and the apparatus comprising an applicator and a support layer, the improvement which comprises a deformable layer with a plurality of surfaces with a substantial vertical deformability in at least one surface, wherein the deformable layer is substantially transparent to ultraviolet radiation.
Dependencies are inferred from the claim text.