Method of making laminated electrostatic printhead

A method of making a high resolution electrostatic printhead without multiplexing comprising the steps of:

• providing printed circuit board material narrow in width;
• holding the material to a flat plate;
• grinding the material to a particular thickness while being held on the flat plate;
• laminating a copper foil layer to both sides of the material;
• etching traces by photolithography in the copper foil layer on at least one side of the material;
• attaching integrated circuit die to the material so as to electrically connect the integrated circuit die to the traces;
• and
• laminating a support plate to the material.

A method of forming an electrostatic printhead comprising the steps of:

• providing first and second substrates;
• laminating a copper foil layer to at least one surface of each substrate;
• etching each copper foil layer to form conductive traces;
• attaching integrated circuit die to the material so as to electrically connect the traces;
• and
• attaching together the first and second substrates by a spacer having a particular thickness therebetween.

A method of making a high resolution non-multiplexed electrostatic printhead comprising the steps of:

• providing a substrate material narrow in width;
• forming the material to a particular thickness;
• then forming the conductive traces on the material;
• then laminating two s-aced-apart support plates to one surface of the material;
• then cutting the material into two portions, the cut being between the two support plates thereby forming two half printheads;
• and
• then fastening together the two half-heads into one printhead.