Semiconductor wafer
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTakao Yasue
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Abstract
A semiconductor wafer having a mark indicating a specified crystal orientation is disclosed. In a preferred embodiment, first and second notches are provided on a circular outer periphery of the semiconductor wafer. A line coupling the vertices of the first and second notches indicates the crystal orientation of the semiconductor wafer. By using such notches as marks for identifying the crystal orientation, the loss of useful area of the semiconductor wafer can be reduced. Generation of slip lines which are crystal defects can be suppressed. Such notches can be formed on the bar member before slicing. By providing the notches on the bar member before individual wafers are cut therefrom, it becomes unnecessary to provide notches on the individual semiconductor wafers one by one.
Claims3
A method of manufacturing a semiconductor wafer having a mark formed and oriented for identifying a specified crystal orientation, comprising the steps of:
- preparing a cylindrical bar member formed of a material for a semiconductor wafer;
- forming a notch which is to be said mark along a generating line of said bar member, said notch having a shape defined by two orthogonally intersecting surfaces oriented with respect to said crystal orientation;
- and
- slicing the bar member across said notch, to form said semiconductor wafer.
Dependencies are inferred from the claim text.