US 5,144,228 AGranted

Probe interface assembly

AssigneeInternational Business Machines Corporation

InventorsMichael A. Sorna, Donald J. Papae

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Abstract

A probe interface assembly connects a set of signal lines and a set of power lines from a circuit tester to one integrated circuit (IC) chip disposed among multiple circuit chips on a semiconductor wafer. The assembly includes a plurality of electrically conductive planes including metal mesh and conductive strips which are spaced apart by ceramic planes contiguous the conductive planes. The signal lines and the power lines enter the assembly with relatively large spacing at an input plane facing the tester, and exit the assembly with relatively small spacing at an output plane facing the chip. Within the assembly, each power line branches into a plurality of conducting vias for reducing resistance and inductance of the power lines. Connection of the vias to the power lines is accomplished by conductive planes near the output plane. Other ones of the conductive planes, near the input plane, interconnect input and output signal lines. Ground planes are interposed between power planes and signal planes.

Claims18

Dependent claims

A probe interface assembly for connecting a circuit tester to a circuit chip, the assembly comprising:

a plurality of parallel electrically conductive planes, and a plurality of electrically insulating planes disposed between the electrically conductive planes;
an array of terminals on a first side of the assembly facing the circuit tester for connection with the circuit tester, and an array of probes on a second side of the assembly facing the circuit chip for connection with the circuit chip;
means for connecting individual ones of said array of terminals with individual ones of said array of probes, said means for connecting including a plurality of vias extending through individual ones of said conductive planes and individual ones of said insulating planes for communicating electrical signals and electric power from said first side to a second side of the assembly;
wherein said plurality of parallel electrically conductive planes includes a set of signal planes comprising strip conductors for conducting electric signals, a set of power planes for conducting electric power, and a set of ground planes;
individual ones of said signal planes are disposed adjacent individual ones of said power planes to form a transmission line with a desired impedance;
individual ones of said ground planes are disposed adjacent individual ones of said power planes to form capacitors with said individual power planes, said set of power planes includes at least one power plane for conduction of electric power at at least one voltage, and each of said insulating planes disposed between a power plane and a ground plane is composed of dielectric material for increasing capacitance of one of said capacitors;
and
wherein said power planes are located in a portion of the assembly closer to said second side, and said signal planes are located in a portion of said assembly closer to said first side in order to minimize lengths of paths for conduction of signals from the tester to the chip.

5 more elements

A probe interface assembly for connecting a circuit tester to a circuit chip, the assembly comprising:

a plurality of parallel electrically conductive planes, and a plurality of electrically insulating planes disposed between the electrically conductive planes;
an array of terminals on a first side of the assembly facing the circuit tester for connection with the circuit tester, and an array of probes on a second side of the assembly facing the circuit chip for connection with the circuit chip;
means for connecting individual ones of said array of terminals with individual ones of said array of probes, said means for connecting including a plurality of vias extending through individual ones of said conductive planes and individual ones of said insulating planes for communicating electrical signals and electric power from said first side to a second side of the assembly;
wherein said plurality of parallel electrically conductive planes includes a set of signal planes comprising strip conductors for conducting electric signals, a set of power planes for conducting electric power, and a set of ground planes;
individual ones of said signal planes are disposed adjacent individual ones of said power planes to form a transmission line with a desired impedance;
individual ones of said ground planes are disposed adjacent individual ones of said power planes to form capacitors with said individual power planes, said set of power planes includes at least one power plane for conduction of electric power at at least one voltage, and each of said insulating planes disposed between a power plane and a ground plane is composed of dielectric material for increasing capacitance of one of said capacitors;
said plurality of vias includes a set of signal vias for conducting electric signals and a set of power vias for conducting electric power, said set of signal vias including at least one signal via group of signal vias for conduction of at least one signal, said set of power vias including at least one power via group of power vias for conduction of electric power at at least one voltage, each signal via group including a plurality of said signal vias and each power via group including a plurality of said power vias;
said connecting means further comprising said set of signal planes and said set of power planes, said signal via groups being connected to respective ones of said set of signal planes and said power via groups being connected to respective ones of said power planes;
wherein in the connection of any one of said signal planes to its signal via group, one signal via connects between the signal plane and one of said array of terminals and a second signal via connects between the signal plane and one of said array of probes;
wherein in the connection of any one of said power planes to its power via group, at least one power via connects between the power plane and at least one of said array of terminals and at least one power via connects between the power plane and at least one of said array of probes;
wherein one of said insulating planes which is disposed between a power plane and an adjacent ground plane is reduced in thickness relative to the thickness of an insulating plane disposed between a signal plane and an adjacent ground plane for increased storage of electrical energy to supply high frequency transient power to a circuit of the chip;
and
wherein said power planes are located in a portion of the assembly closer to said second side, and said signal planes are located in a portion of said assembly closer to said first side in order to minimize path lengths for conduction of signals from the tester to the chip.

10 more elements

A probe interface assembly for connecting a circuit tester to a circuit chip, the assembly comprising:

a plurality of parallel electrically conductive planes, and a plurality of electrically insulating planes disposed between the electrically conductive planes;
an array of terminals on a first side of the assembly facing the circuit tester for connection with the circuit tester, and an array of probes on a second side of the assembly facing the circuit chip for connection with the circuit chip;
means for connecting individual ones of said array of terminals with individual ones of said array of probes, said means for connecting including a plurality of vias extending through individual ones of said conductive planes and individual ones of said insulating planes for communicating electrical signals and electric power from said first side to a second side of the assembly;
wherein said plurality of parallel electrically conductive planes includes a set of signal planes comprising strip conductors for conducting electric signals, a set of power planes for conducting electric power, and a set of ground planes;
individual ones of said signal planes are disposed adjacent individual ones of said power planes to form a transmission line with a desired impedance;
individual ones of said ground planes are disposed adjacent individual ones of said power planes to form capacitors with said individual power planes, said set of power planes includes at least one power plane for conduction of electric power at at least one voltage, and each of said insulating planes disposed between a power plane and a ground plane is composed of dielectric material for increasing capacitance of one of said capacitors;
said plurality of vias includes a set of signal vias for conducting electric signals and a set of power vias for conducting electric power, said set of signal vias including at least one signal via group of signal vias for conduction of at least one signal, said set of power vias including at least one power via group of power vias for conduction of electric power at at least one voltage, each signal via group including a plurality of said signal vias and each power via group including a plurality of said power vias;
said connecting means further comprising said set of signal planes and said set of power planes, said signal via groups being connected to respective ones of said set of signal planes and said power via groups being connected to respective ones of said power planes;
wherein in the connection of any one of said signal planes to its signal via group, one signal via connects between the signal plane and one of said array of terminals and a second signal via connects between the signal plane and one of said array of probes;
wherein in the connection of any one of said power planes to its power via group, at least one power via connects between the power plane and at least one of said array of terminals and at least one power via connects between the power plane and at least one of said array of probes;
wherein one of said insulating planes which is disposed between a power plane and an adjacent ground plane is reduced in thickness relative to the thickness of an insulating plane disposed between a signal plane and an adjacent ground plane for increased storage of electrical energy to supply high frequency transient power to a circuit of the chip;
and
further comprising a plurality of grounded vias encircling said one signal via.

10 more elements

Dependencies are inferred from the claim text.