Semiconductor assembly utilizing elastomeric single axis conductive interconnect

A semiconductor assembly comprising:

• a plurality of dies having substantially planar first and second engagement surfaces, engagement surfaces including one or more conductive pads, defined thicknesses therebetween, and external edges which define die eternal shapes, the first engagement surfaces including one or more conductive pads;
• a base having a plurality of openings formed therein, the base openings having peripheral edges which define opening shapes which are complementary to the respective die external shapes, the respective openings being sized to receive and engage respective dies, the respective dies being so received within the respective base openings with the opening edges engaging the respective die edges to spatially fix the respective dies in a selected orientation in a plane parallel to the respective die first planar engagement surfaces;
• an interconnecting plate having at least one substantially planar engagement surface facing the first planar engagement surfaces of the dies received within the base openings, the plate planar engagement having a plurality of conductive pads and traces formed thereon, the conductive pads of the plate planar engagement surface being spatially aligned with respective conductive pads on the first planar engagement surfaces of the dies received within the base openings;
• a sheet of anisotropically conductive elastomeric material that is electrically conductive in a direction across its thickness, the sheet being interposed between the base and interconnecting plate between the first engagement surfaces of the dies and engagement surface of the interconnecting plate;
• and
• clamping means engaging the base and interconnecting plate for urging the dies and plate toward one another in spatial registration to conductively engage the conductive pads of the dies with conductive pads of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.