Method for metal bonding
AssigneeLord Corporation
InventorsStephen R. Holmes-Farley, Lynn C. Yanyo, Anna M. Thuer
Life of this patent
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Abstract
A method for bonding a metal substrate to a similar or dissimilar substrate by first applying a primer coating to the surface of the metal substrate and then bonding the primed metal substrate to the other substrate. At least part of the primer coating is composed of a uniform, ultra-thin film that is formed by immersing, prior to bonding, the metal substrate in a solution that has undergone substantially no polymer growth. The solution contains at least one hydrolyzable metal alkoxide of a polymer network-forming cation, water, a solvent and a base. The metal substrate is allowed to react with the solution for a time sufficient to form in situ an ultra-thin film on the metal substrate.
Claims16
In a method for bonding a metal substrate to a similar or dissimilar substrate wherein a primer coating is first applied to the metal substrate surface and the metal substrate is then bonded to the similar or dissimilar substrate with a bonding adhesive, the improvement wherein at least part of the primer coating is comprised of a uniform, ultrathin film formed by immersing, prior to said bonding, the metal substrate in a solution comprising from about 0.0001 to 30 parts by volume of at least one hydrolysable metal alkoxide of a polymer network-forming cation, from about 1 to 60 parts by volume of water, from about 20 to 95 parts by volume of an organic solvent and from about 0.01 to 3 parts by volume of a base, said solution having undergone substantially no polymer growth and said metal substrate being immersed in said solution within no more than about ten minutes after formation of said solution, for a time sufficient to form in situ said film on said substrate.
Dependencies are inferred from the claim text.