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US 5,137,248 AGranted
Structure for mounting elastic member to casing of electronic equipment
AssigneeKabushiki Kaisha Toshiba
InventorsToshiyuki Sato, Shuichiro Wakayama
Life of this patent
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Abstract
A structure for mounting elastic members such as legs to a casing of an electronic equipment, wherein, when the casing of the electronic equipment provided therein with holes for mounting the elastic member is subjected to an injection molding with use of elastic material to provide the elastic member, the elastic member is integrally mounted to the casing of the electronic equipment.
Claims18
A structure for mounting an electronic equipment including a circuit board, comprising:
- a casing for the electronic equipment;
- and
- an elastic member mounted to said casing;
- wherein said casing includes a hole for mounting said elastic member and said elastic member is adapted for mounting the printed circuit board thereon, said elastic member being formed to extend from said hole by means of injection molding;
- and
- said elastic member including printed circuit board holding means for holding the printed circuit board, said printed circuit board holding means being integrally formed with said elastic member at the time of performing the injection molding.
3 more elements
A structure for mounting an electronic equipment including a printed circuit board, comprising:
- a casing for the electronic equipment;
- and
- an elastic member mounted to said casing;
- wherein said casing includes a hole for mounting said elastic member and said elastic member is adapted for maintaining the a printed circuit board thereon, said elastic member being formed to extend from said hole by means of injection molding, said casing including an elastic communication path formed on a back side thereof by an injection molding material flowed toward said hole when performing the injection molding, said elastic communication path having printed circuit board holding means for holding the printed circuit board and integrally formed with said elastic communication path by the injection molding material when peforming the injection molding.
1 more element
Dependencies are inferred from the claim text.