Anisotropic conductive adhesive and encapsulant material
AssigneeMotorola, Inc.
InventorsRobert W. Pennisi, Marc V. Papageorge, Glenn F. Urbish
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Abstract
An adhesive material 220 including a fluxing agent and metal particles 240 is applied to either a substrate 200 having a metallization pattern 210 or an electrical component 230. The component 230 is positioned on the substrate 210 and heated. During the heating step, the fluxing agent promotes adhesion of the metal particles 240 to the substrate metallization pattern 210 and the component, and the adhesive material 220 is cured, to mechanically interconnect and encapsulate the substrate 210 and the component 230.
Claims19
An adhesive having a fluxing agent and metal particles for use in reflow soldering and interconnecting an electrical component and a substrate, comprising;
- a thermoset resin,
- a fluxing agent,
- a curing agent, and
- metal particles, said metal particles melting to form a metallurgical bond to the electrical component and the substrate during the reflow soldering, and said adhesive having the property of being anisotropically conductive after the reflow.
An electrical component assembly, comprising:
- an electrical component having a plurality of electrical terminations;
- a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component;
- and
- an anisotropically conductive adhesive material for connecting the electrical component to the substrate, comprising;
- an epoxy resin,
- a fluxing agent,
- a curing agent, and
- solder particles reflowed to form a metallurgical bond between and electrically connecting the electrical component and the substrate, said anisotropic adhesive material being disposed between and bonding the electrical component and the substrate, and having different conductivity in different directions.
Dependencies are inferred from the claim text.