Charged-particle beam exposure method and apparatus
AssigneeFujitsu Limited
InventorsKiichi Sakamoto, Yoshihisa Oae, Shunsuke Fueki, Akio Yamada, Hiroshi Yasuda
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AssigneeFujitsu Limited
InventorsKiichi Sakamoto, Yoshihisa Oae, Shunsuke Fueki, Akio Yamada, Hiroshi Yasuda
Estimating the term…
A charged-particle beam exposure method which has a stencil mask formed with a several mask patterns, deflects a beam of charged particles to a mask pattern selected from among the several mask patterns and shapes the beam, and performs wafer exposure by deflecting the shaped beam and illuminating the same onto a wafer. The improvement comprises the steps of (a) holding mask information data, which are information for deflecting the charged particle beam to the selected mask pattern and in which an index is provided every mask pattern of the stencil mask, in a mask memory, (b) holding pattern exposure data, which are information for designating a mask pattern by the use of the index of each mask pattern held in the mask memory and for deflecting the charged particle beam shaped with the designated mask pattern to a predetermined region on the wafer, in a data memory; and (c) deflecting the charged particle beam of the stencil mask and shaping the beam by the use of the mask information data outputted from the mask memory in response to the index designated in the pattern exposure data.
A charged-particle beam exposure method which uses a stencil mask formed with a plurality of mask patterns, deflects a beam of charged particles to a mask pattern selected from among said plurality of mask patterns, and shapes said beam of charged particles, and performs waver exposure by deflecting said shaped beam and illuminating said shaped beam onto a wafer, wherein the improvement comprises the steps of:
A charged-particle beam exposure apparatus comprising a source of a charged particle beam, a wafer stage having mounted thereon a wafer that is exposed by said charged particle beam, a stencil mask disposed between said source of said charged particle beam and said wafer stage and formed with a plurality of mask patterns through which said charged particles beam is passed and shaped, a mask part deflect controller for controlling deflection conditions of said charged particle beam that is illuminated on said stencil mask, a wafer part deflect controller for controlling deflection conditions of said charged particle beam passed through said stencil mask with respect to said wafer, wherein said charged-particle beam exposure apparatus comprises:
A charged-particle beam exposure method, comprising the steps of:
A charged-particle beam exposure method, comprising the steps of:
Dependencies are inferred from the claim text.