Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens

A reflective photosensor comprising:

• an insulation substrate;
• an electrically conductive film formed on an upper surface of the insulation substrate;
• a light emitting element arranged on the conductive film;
• a light receiving element arranged on the conductive film;
• an optically transparent molded resin in which the substrate, conductive film, light emitting element and receiving element are embedded;
• a plurality of leads, each having one end attached to a lower surface of the insulation substrate and a second end outside of said molded resin to be exposed, electrically connected to said conductive film, light emitting element and light receiving element;
• and
• a planar optical element attached to an upper surface of said molded resin, having:
• a first micro Fresnel lens portion for projecting a light emitted from said light emitting element toward an object to be sensed in an external space;
• and
• a second micro Fresnel lens portion for introducing a reflection light reflected from said object to the light receiving element.

A reflective photosensor comprising:

• an insulation substrate;
• an electrically conductive film formed on an upper surface of the insulation substrate;
• a light emitting element arranged on the conductive film;
• a light receiving element arranged on the conductive film;
• an optically transparent molded resin in which said substrate, conductive film, light emitting element and light receiving element are embedded, said molded resin being formed with a recesses above said light emitting element and the light receiving element;
• a plurality of leads, each having one end attached to a lower surface of the insulation substrate and a second end extended outside said molded resin to be exposed, each of said leads being respectively electrically connected to said conductive film, light emitting element and light receiving element;
• and
• a planar optical element having:
• a first micro Fresnel lens portion for projecting a light emitted from the light emitting element toward an object to be sensed in an external space;
• and
• a second micro Fresnel lens portion for introducing a reflection light reflected from said object to said light receiving element;
• the planar optical element being attached to an upper portion of the molded resin such that Fresnel lens patterns of said first and second micro Fresnel lens portions face said areas within said recesses.

A reflective photosensor comprising:

• at least three leads;
• a light emitting element fixed on one end of a first of said leads;
• a light receiving element fixed on one end of second of said leads;
• a reflecting means arranged on said one end of said first lead ajacent to said light emitting element;
• an optically transparent molded resin in which one end of each of said leads, said light emitting element, said light receiving element and said reflect means are embedded, said molded resin being formed to have an external contour substantially identical to a flat parallelepiped, said leads extending to outside of a molded resin to be exposed at respective other ends thereof;
• said the first lead being electrically connected to one electrode of said light emitting element;
• said second lead being electrically connected to one electrode of said light receiving element;
• said third lead being electrically connected to second electrodes of both said light emitting element and said light receiving element;
• a planar optical element having:
• a first micro Fresnel lens portion for projecting a light emitted from the light emitting element toward an object to be sensed in an external space;
• and
• a second micro Fresnel lens portion for introducing a reflection light reflected from the object to the light receiving element;
• said planar optical element being attached to an upper surface of said molded resin;
• said light emitting element being of an edge emitting type and being arranged in the molded resin in a posture in which light emitted therefrom is substantially parallel to the upper surface of said molded resin;
• and
• said reflecting means reflecting said light emitted from an end of said light emitting element toward said first micro Fresnel lens portion of the planar optical element.

A reflective photosensor comprising:

• a package formed with two recesses;
• a light emitting element disposed in said first recess;
• a light receiving element disposed in said second recess;
• reflecting means disposed in said first recess;
• a planar optical element having:
• a first micro Fresnel lens portion for projecting light emitted from said light emitting element toward an object to be sensed in an external space;
• and
• a second micro Fresnel lens portion for introducing a reflection light reflected from said object to said light receiving element;
• said planar optical element being attached to an upper portion of said package;
• said light emitting element being of an edge emitting type and being arranged in said first recess in a posture in which a light emitted therefrom is substantially parallel to the surface of said planar optical element;
• and
• said reflecting means reflecting said light emitted from an end of said light emitting element toward said first micro Fresnel lens portion of said planar optical element.

A semiconductor light emitting apparatus comprising:

• a housing body, which includes a heat sink, formed with a window at a top thereof;
• a transparent member covering said window;
• said housing body accommodating therein a light emitting diode of an edge emitting type and a micro Fresnel lens;
• said light emitting diode being attached to said heat sink;
• said micro Fresnel lens being aligned with said light emitting diode with respect to respective optical axes;
• said light emitting diode having a central wavelength in the vicinity of a design wavelength of said micro Fresnel lens;
• light emitted from the light emitting diode passing through the micro Fresnel lens to be collimated or to be focused and projected outside through said transparent member.

A semiconductor light emitting apparatus comprising:

• at least two leads;
• a light emitting diode of an edge emitting type fixed on one end of said first lead;
• said first lead being electrically connected to one electrode of said light emitting diode;
• said second lead being electrically connected to another electrode of the said emitting diode;
• an optically transparent molded resin in which one end of said leads and said light emitting diode are embedded, said leads extending outside of the molded resin to be exposed at respective other ends thereof;
• and
• a planner optical element having a micro Fresnel lens for projecting light emitted from said light emitting diode toward outside of said molded resin, said planar optical element being attached to an upper surface of the molded resin.