Method of curing thermoset bonding agent for non-distortion self-supporting thermoset component parts

A thermal adhesive bonding method, directed toward minimizing of processing time and control of distortion, for joining of thermoset plastic elements subject to further subsequent working and subject to distortion in the presence of minimum distortion related temperature at which the mass is distorted directly or under said subsequent working, comprising:

• forming an uncured thermosetting adhesive adapted to bond to said elements and having a cure characteristic with the curing of said adhesive activated by heating and accelerated by heat, said adhesive having integral means responsive to an externally generated energy field to create heat directly within the adhesive, said adhesive being in a flowable state,
• applying said adhesive mixture between the elements to be bonded in a thickness at least equal to 0.005 inch thick to form an intimate engaging coating to the elements,
• applying a compression force across said elements to move said adhesive and to maintain the spacing between said elements equal to at least 0.005 inches and less than 0.2 inches and to eliminate air pockets within the bond area and adhesive,
• generating an energy field of a controllable intensity through the elements and said adhesive for a total period no greater than about 30 seconds to generate heat essentially solely within the adhesive and activate the adhesive,
• continuously controlling the intensity of said field to maintain said particles activated during said total period and in a timed sequence including a first time period of relatively high field intensity to rapidly raise the temperature of the adhesive to a first elevated level to initiate activation of the adhesive to create a partially gelled condition, and a second time period immediately following said first time period including continuing the field intensity of said energy field and controlling said lower intensity to produce activation of said particles and maintaining a controlled input of heat to the adhesive and thereby an elevated temperature to continue a chemical reaction and creating the gelled state of said adhesive during said second period, and upon creating said gelled state terminating said energy field and removing said compression force from said elements, and thereby creating a minimal processing time no greater than about 30 seconds for adhesively joining the elements for subsequent working without deleterious distortion of the elements, and subjecting said elements to subsequent working.