Cooling system for an electronic circuit device

In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which comprises a conduit for coolant flow, a first heat transfer plate directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, a low-melting-point metal interposed between the first heat transfer plate and the circuit component, said low-melting-point metal being capable of being melted by the heat from the circuit component, and elastic means connected between the first heat transfer plate and the conduit for resiliently biasing the first heat transfer plate against the circuit component through the low-melting-point metal, said cooling system further comprising means for facilitating expansion of the low-melting-point metal as the latter becomes liquidized.

In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which comprises a conduit for coolant flow, a first heat transfer plate directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, a low-melting-point metal interposed between the first heat transfer plate and the circuit component, said low-melting-point metal being capable of being melted by the heat from the circuit component, and elastic means connected between the first heat transfer plate for resiliently biasing the first heat transfer plate and the conduit against the circuit component through the low-melting-point metal, said cooling system further comprising means for discharging air bubbles from the low-melting-point metal.

In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which comprises a conduit for coolant flow, a first heat transfer plate directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, a low-melting-point metal interposed between the first heat transfer plate and the circuit component, said low-melting-point metal being capable of being melted by the heat from the circuit component, and elastic means connected between the first heat transfer plate for resiliently biasing the first heat transfer plate and the conduit against the circuit component through the low-melting-point metal, said cooling system further comprising means for preventing leakage of the low-melting-point metal from between the first heat transfer plate and the circuit component.

In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which comprises a conduit for coolant flow, a first heat transfer plate directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, a low-melting-point metal interposed between the first heat transfer plate and the circuit component, said low-melting-point metal being capable of being melted by the heat from the circuit component, and elastic means connected between the first heat transfer plate for resiliently biasing the first heat transfer plate and the conduit against the circuit component through the low-melting-point metal, said cooling system further comprising means for directing a flow of high temperature fluid into said conduit when the low-melting-point metal is to be melted.

In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which comprises a conduit for coolant flow, a first heat transfer plate directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, a low-melting-point metal interposed between the first heat transfer plate and the circuit component, said low-melting-point metal being capable of being melted by the heat from the circuit component, and elastic means connected between the first heat transfer plate and the conduit for resiliently biasing the first heat transfer plate against the circuit component through the low-melting-point metal, said cooling system further comprising heating means in the first heat transfer plate for heating the low-melting-point metal.