High temperature solder device for flat cables

A method for soldering multi-pin connectors to thin fragile flat ribbon cables having a plurality of conductors using high temperature/high thermal fatigue solders comprising the steps of:

• 1) providing a heat sink having a flat surface;
• 2) exposing a portion of the conductors of said flat ribbon cable and positioning said flat ribbon cable on said flat surface with said exposed portion of said conductors facing upward;
• 3) positioning the pins of said multi-pin connector above said exposed portion of said conductor in a manner such that each pin of said multi-pin connector is above a corresponding exposed conductor of said flat ribbon cable;
• 4) placing a suitable amount of solder having a melting temperature above 200.degree. C. and also a high thermal fatigue characteristic between the first pin of said multi-pin connector and its corresponding exposed conductor;
• 5) providing a downward compressive force on said first pin of said multi-pin connector with an electrode having a first half and a second half, the tips of said electrode halves conforming to the shape of said pins of said multi-pin connector;
• 6) providing a short duration, high density, electrical pulse of energy through said solder by sending an electrical current down said first half of said electrode and back up said second half of said electrode thereby melting said solder without excessive heat and joining said first pin of said multi-pin connector to its corresponding exposed conductor without damage to said flat ribbon cable;
• 7) repeating steps 4 through 6 until all pins of said multi-pin connector are soldered to their corresponding exposed conductors.