Heat exchanger for solid-state electronic devices
AssigneeMicroUnity Systems Engineering, Inc.
InventorJames A. Matthews
Life of this patent
Estimating the term…
Abstract
A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates, laminated together to form a block. Each plate has a microscopic recessed portion etched into one face of the plate and a pair of holes cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.
Claims21
A heat exchanger for cooling a heat generating device comprising:
- a plurality of plates each having a microscopic recessed portion along at least one face, said plates being laminated together to form a block wherein a corresponding plurality of enclosed microscopic slots are formed by the recessed portions of said plates within said block;
- coolant manifold means for flowing a coolant fluid through said enclosed slots, said device being cooled when placed in contact with said block.
A heat exchanger for cooling a heat generating device comprising:
- a core element containing a plurality of microscopic channels enclosed therein, said core element comprising a plurality of laminated plates, each plate having a microscopic recessed portion along at least one face, wherein the recessed portions of said plates correspond to said plurality of enclosed microscopic channels;
- and
- a coolant manifold means for flowing a coolant fluid through said enclosed microscopic channels, said device being cooled when placed in contact with said core element.
The heat exchanger of 13 wherein said core element comprises a material having a high thermal conductivity.
Dependencies are inferred from the claim text.