Transmission electron microscope (TEM) power probe for in-situ viewing of electromigration and operation of an integrated circuit or microprocessor

Abstract

A power probe for in-situ electron microscope viewing of electromigration in aluminum thin films has a probe holder, a detachable probe tip and, mounted on the probe tip, a quartz power distributor. A test specimen, such as an integrated circuit component, can be viewed inside the electron microscope while logic gates or other components are exercised. The probe holder is shaped to mate to a conventional electron microscope side entry port. The probe tip attaches to the end of the probe holder and extends into the electron beam path. The test specimen mounts on the power distributor which is in turn mounted inside a trough at the end of the detachable probe tip. The probe tip and power distributor include mutually aligned openings, over which the test specimen mounts, for the electron beam path. The power probe is vacuum sealed on the outside by a convention O-ring seal and inside by a female electrical connector mounted on the front end of the probe holder and a male electrical connector mounted on the back end of the probe tip, both electrical connectors being cemented in place with a high-vacuum glue. The power distributor includes bonding pads and a grounding pad for mounting test specimens.

Dependencies are inferred from the claim text.