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US 5,123,989 AGranted
Resin-bonding method
AssigneesToda Kogyo Corporation, Dai-Ichi High Frequency Co., Ltd.
InventorsNanao Horiishi, Kotaro Hirayama, Masanori Terasaki, Tetsuro Toda, Shigeru Takaragi
Life of this patent
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Abstract
Disclosed herein is a method for bonding a resin part, which comprises disposing a magnetic complex composed of a resin and magnetic particles as a heating-medium at the resin parts to be bonded, and applying an alternating magnetic field to the heating-medium by using a magnetic field generating means composed of an electromagnetic core and an exciting coil, thereby making said heating-medium generate heat for fuse-bonding said resins.
Claims6
A method for bonding a resin part, said method comprising the steps of:
- disposing as a heating-medium at said resin part a magnetic complex having a coercive force (Hc) of not less than 50 Oe, a maximum flux density (Bm) of not lower than 1,000 G and a residual flux density/coercive force (Br/Hc) ratio of not less than 1.3 and being composed of a resin and 0.1 to 90% by weight of magnetic particles which have a coercive force (Hc) of not less than 50 Oe and are selected from the group consisting of iron oxide particles, ferrite particles and a mixture thereof;
- and
- applying an alternating magnetic field to said heating-medium with an intensity of 2 to 15 times the coercive force (Hc) of said heating-medium, by using a magnetic field generating means comprising a high-frequency power source and a heating-unit comprising an electromagnetic core and an exciting coil, in a frequency of 1 to 400 KHz, thereby causing said heating-medium to generate heat for fuse-bonding said resin part.
Dependencies are inferred from the claim text.