Molding device for sealing semiconductor element with resin

A device for sealing with resin a lead frame on which a semiconductor element is bonded, said device comprising:

• (a) a bottom die;
• (b) a top die located above said bottom die and movable toward said bottom die;
• (c) a pin planted at an end position on a top surface of said bottom die;
• (d) holding means for holding said lead frame;
• (e) a plate member coupled to said holding means and having a vertical through hole at an end region of said plate member;
• (f) X-Y driver means for driving and moving said plate member and said holding means in horizontal X-Y directions;
• (g) carrier means for carrying said plate member and said holding means holding said lead frame to a gap space between said top die and said bottom die and for placing said lead frame on said bottom die so that said semiconductor element is aligned with said top and bottom dies;
• (h) image detector means connected to said plate member and operable to detect respective images of said hole and said pin and generate an image signal representing said images when said plate member is inserted into said gap space;
• (i) control means for receiving said image signal and generating a control signal of said X-Y driver means so that said hole and said pin are aligned;
• and
• (j) means for supplying resin into a cavity formed between said and top and bottom dies after said top die goes down to said bottom die and semiconductor element is accommodated in said cavity.