Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass
AssigneeAluminum Company of America
InventorsJau-Ho Jean, Tapan K. Gupta
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Abstract
A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree. C. from room temperature to 200.degree. C. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % titanium silicate glass. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.
Claims14
A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2, said composition comprising a mixture of finely divided particles of:
- (a) 25-50 vol. % borosilicate glass;
- and
- (b) 50-75 vol. % titanium silicate glass.
A castable ceramic composition comprising:
- (a) mixture of 25-50 vol. % borosilicate glass and 50-75 vol. % titanium silicate glass;
- (b) 15-30 wt. % of an organic medium comprised of a polymeric binder dissolved in, an organic solvent.
A method of making a ceramic dielectric body having a dielectric constant of less than about 4.2, comprising the steps of;
- (a) providing a mixture consisting essentially of finely divided particles of comprising 25-50 vol. % borosilicate glass and 50-75 vol. % titanium silicate glass;
- and
- (b) sintering the mixture in air to a temperature not greater than about 1000.degree. C.
A multilayer ceramic circuit board formed of a plurality of laminated ceramic circuit board units, each unit including a ceramic insulating layer, a patterned electrical conductor layer supported on said ceramic insulating layer and through hole electrical conductors for connecting said patterned electrical conductor layers of said respective ceramic circuit board units to form a wiring circuit, said electrical conductor layers and said through hole electrical conductors selected from the group of gold, silver and palladium said ceramic insulating layer comprising:
- a sintered mixture of 25-50 vol. % borosilicate glass and 50-75 vol. % titanium silicate glass, said ceramic insulating layer sintered at a temperature below the melting temperature of said patterned electrical conductor layers and said through hole electrical conductors.
Dependencies are inferred from the claim text.